Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two-component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock.
Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste has superior chemical resistance and also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO.
Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber.
With enhanced chemical resistance, Master Bond MasterSil 930 is an acetoxy-type fluorosilicone for bonding, sealing and coating applications in aerospace, electronics, specialty OEM and other industries.
Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond EP3RR-80 is a one component epoxy that offers user friendly handling.
Used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications.
Formulated primarily for high-performance structural bonding applications, Master Bond EP13SPND-2 is a one-part, high temperature-resistant epoxy for the aerospace and specialty OEM industries.
Specially formulated for medical device applications, Master Bond MasterSil 912Med is a room temperature vulcanizing silicone system for high-performance bonding, sealing and coating.
Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system.
Combining simple handling properties with high strength, Master Bond Supreme 10HTF-1 is a single part adhesive/sealant for a variety of applications in the aerospace, electronic, optical, specialty OEM and related industries.
Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15┬Ám.
Passing ASTM E595 testing for NASA low outgassing, Master Bond MasterSil 920-LO is a high performance, room temperature vulcanizing silicone for sealing, coating and small encapsulations.
Master Bond EP42HT-2LTE is often chosen for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries.
Well suited for bonding dissimilar substrates, Master Bond UV15X-2 is a one part UV curable adhesive, sealant, coating and potting compound.
Master Bond Supreme 12AOHT-LO is a one component epoxy for a variety of bonding and sealing applications in the aerospace, electronic, electro-optic and OEM industries.
Featuring a non-halogen filler, Master Bond's EP21FRNS-2 curing epoxy passes UL 94V-0 testing for flame retardancy in potting, encapsulation and casting applications.
Combining superior physical strength and fast cure rates, Master Bond UV16 is formulated for demanding bonding, sealing, and coating applications.
For demanding applications where highly flexible, impact resistant bonds are required, Master Bond developed Polymer System EP37-3FLF.
Master Bond Inc.'s EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue.
Master Bond Inc. EP65HT-1 combines high temperature resistance and fast room temperature curing in a NASA low outgassing approved epoxy.
For superb adherence to a wide variety of substrates including many metals, plastics, rubbers, ceramics and glass, Polymer System EP31 was developed by Master Bond Inc.

Please Log In or Create an account First to View Our Digital Edition