C6025 Industrial PC

December 10,2019
C6025 Industrial PC

Beckhoff Automation has announced another addition to the popular family of ultracompact C60xx series Industrial PCs (IPCs) with the new C6025. This space-saving IPC delivers the high computing performance of the Intel Core i series in a fanless, small-form-factor device. The new Intel Core i U processors, with exceptionally low power requirements, have made this advancement possible.

Measuring just 82 x 127 x 40 mm and combining high computing performance with a fanless design, the Microsoft “Azure Certified” C6025 IPC is an ideal choice for demanding automation and IoT applications where green, sustainable IT is also a requirement. The Intel Core i U processors deliver Core i performance capabilities yet consume significantly less power than other processors of the same series. The 8th Gen Intel Core i U processors used in the C6025 also offer an advantage typical of evolving PC-based technology: higher performance at the same price point as previous offerings. With this new addition, the Beckhoff portfolio of industry-ready and long-term available IPCs now spans five CPU performance classes – from ARM through to Intel Xeon – for maximum hardware scalability.

The energy-efficient Intel Core i U processors in the IPC, in combination with an advanced cooling design, enable fully passive heat dissipation via a heat sink on one side. Housed in an aluminum and zinc die-cast enclosure, the C6025 feature set offers the following:

  • up to four CPU cores
  • 4 GB DDR4 RAM (expandable to 8 GB)
  • 40 GB M.2 SSD with 3D flash memory
  • 1 x DisplayPort video connector
  • 4 x USB 3.0 ports
  • on-board Ethernet controller with 3 x 100/1000Base-T ports
  • operating temperature range of 0 to 50° C

The energy-efficient, ultra-compact C6025 IPC expands the broad PC-based control portfolio from Beckhoff to offer a performance level situated between the entry-level devices with Intel Atom CPUs and those with high-end Intel Core i-series processors. With this addition, the Beckhoff product portfolio better addresses the growing trend toward compact, fanless IPCs while supporting applications with highly intensive computing requirements.

Related Glossary Terms

  • flash

    flash

    Thin web or film of metal on a casting that occurs at die partings and around air vents and movable cores. This excess metal is due to necessary working and operating clearances in a die. Flash also is the excess material squeezed out of the cavity as a compression mold closes or as pressure is applied to the cavity.