TS 750 High-Precision Touch Probe

June 16,2021

Related Glossary Terms

  • grinding

    grinding

    Machining operation in which material is removed from the workpiece by a powered abrasive wheel, stone, belt, paste, sheet, compound, slurry, etc. Takes various forms: surface grinding (creates flat and/or squared surfaces); cylindrical grinding (for external cylindrical and tapered shapes, fillets, undercuts, etc.); centerless grinding; chamfering; thread and form grinding; tool and cutter grinding; offhand grinding; lapping and polishing (grinding with extremely fine grits to create ultrasmooth surfaces); honing; and disc grinding.

TS 750 High-Precision Touch Probe Now Available for In-Process Workpiece Measurement

HEIDENHAIN’s new TS 750 high-precision touch probe is now available for in-process workpiece measurement in grinding machines and lathes.  This extremely durable new probe offers the ability to state the reproducibility of its jobs at increased probing speeds better than its competitors.  And the low probing force inherent in the new TS 750 is an important benefit when working with soft or delicate workpieces.

The TS 750 operates with high-precision pressure sensors, with force analysis for generating the trigger pulse. The forces that arise during probing are processed electronically. This method delivers extremely homogeneous, 360° probing accuracy.  It offers high probing speed of up to1 m/min and does not require a minimum speed.

Also, due to its very low probing forces of approximately 1.5 N (axial) and 0.2 N (radial), the TS 750 can attain high probing accuracy (±1 µm) and repeatability with almost no effect on the measured object. Only on further deflection do the forces of the springs take effect until the machine stops.

Delivering reliable measurements after prolonged use -even after five million probing cycles- this TS 750 touch probe is still highly accurate: with a probing repeatability of down to 2 σ ≤ 0.25 µm at its high probing speed. This is highly unusual in the industry.