Talisker HE Lasers

Contact Details

Coherent Inc.
Address
5100 Patrick Henry Dr.
Santa Clara
95054
CA
United States
Phone
408-764-4983
Toll Free Phone
800-527-3786
Fax
408-988-6838

41.9646479, -87.6737492

September 13,2013

Coherent Inc. has expanded its family of industrial ultrafast lasers with the Talisker HE series, whose high energy pulses reportedly enable drilling, cutting and scribing of thicker materials than with other ultrafast lasers. Talisker HE lasers are available with a choice of output options; 200 microJ pulse energy in the near-IR (1064 nm), 120 microJ per pulse in the green (532 nm), or 40 microJ pulse energy in the ultraviolet (355 nm). Talisker HE is ideal for high-throughput, precision materials processing in industries such as automotive, biomedical, consumer electronics, mobile display and 3D semiconductor.

Talisker lasers are a family of industrial picosecond products, well documented to deliver higher quality process finished goods than conventional pulsed lasers or non-laser micromachining methods. Picosecond lasers achieve the quality improvement using a process known as "Cold Ablation," due to negligible unwanted thermal effects. The result is improved process quality with minimized heat affected zone (HAZ) and no unwanted melt debris.

Cold Ablation occurs when the intensity of the laser beam exceeds the ablation threshold. The pulse energy of the new Talisker HE series is significantly higher than other lasers in the Talisker family. The significantly higher pulse energy extends the optical depth of the focused beam so that cold ablation occurs throughout the full thickness of the target material, eliminating thermal debris.

The higher energy pulses are used in a variety of materials processing techniques. Single shot pulses replace percussively drilled holes; very thick materials are drilled with reduced taper; engraving and trepanning benefit from deeper, high aspect ratio structuring.

The Talisker HE distinguishes itself with enhanced pointing stability. Pointing stability is critical to drilling thick materials where the pulses must be directed to the target with dependable accuracy. The maximum material thickness is ultimately limited by a combination of the laser pulse energy and the pointing stability.

Related Glossary Terms

  • trepanning

    trepanning

    Drilling deep holes that are too large to be drilled by high-pressure coolant drills or gundrills. Trepanning generates a solid core and normally requires a big, powerful machine. Shallow trepanning operations can be performed on modified engine or turret lathes or on boring machines. See boring; drilling; spade drilling.