A new series of laser line generators from Coherent Inc. enables the detection of smaller features in machine vision applications based on triangulation. Specifically, StingRay µFocus (Micro Focus) lasers feature a linewidth that is 40 percent smaller than standard Coherent StingRay products (at the same working distance), and can achieve focused linewidths as small as 20 µm, thus providing increased spatial resolution and the ability to discern finer details. Based on cost-effective laser diode technology, StingRay µFocus modules are available at wavelengths of 520 nm, 660 nm, 785 nm, and 830 nm, at power levels of up to 200 mW.
StingRay µFocus laser line generators deliver all the same performance and ease of use features as their predecessors. This includes an industry leading line intensity uniformity specification (±5 percent), which yields increased measurement speed and greater dimensional accuracy. These lasers also support “dynamic line balancing,” which allows for the correction of any intensity bias in configurations where the laser must be used at off axis illumination angles. To further enhance usability, Stingray µFocus lasers include an internal “health monitor” that indicates when a diode is approaching end of life, thus allowing for planned replacement, and avoiding production downtime due to an unexpected failure.
Stingray µFocus lasers are targeted at any machine vision application that requires high precision 3D profiling. This includes numerous uses in microelectronics manufacturing, glass inspection, medical and dental implant production, high-precision extrusion and feature alignment in automotive assembly.
Related Glossary Terms
Conversion of an ingot or billet into lengths of uniform cross section by forcing metal to flow plastically through a die orifice.
Machining vertical edges of workpieces having irregular contours; normally performed with an endmill in a vertical spindle on a milling machine or with a profiler, following a pattern. See mill, milling machine.