Driving Future Technologies Brochure

June 15, 2022
High-Precision Motion and Control Solutions for Laser and Photonics Applications

PI’s newest brochure, which debuted to a global audience at the 2022 LASER World of Photonics Conference, provides precision motion solutions to all industries that work with laser and optical technologies, including material processing, test & metrology, optics alignment, and micro-assembly.

Individual applications addressed in the new brochure are:

  • Assembly and Packaging of Photonic Devices
  • Laser Seam Welding of Electronic Packages Using Galvo Scanners
  • Laser Drilling of High-Density Micro Holes
  • Wafer Stealth Dicing
  • Wafer Inspection and Metrology
  • Characterization of Light Emitting Devices such as Micro LEDs, SiP Wafers, etc.
  • Seam Sealing of Electronic Packages Using Pulsed Laser Sources

    Download “Driving Future Technologies” Brochure

Related Glossary Terms

  • metrology


    Science of measurement; the principles on which precision machining, quality control and inspection are based. See precision machining, measurement.


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