PI’s newest brochure, which debuted to a global audience at the 2022 LASER World of Photonics Conference, provides precision motion solutions to all industries that work with laser and optical technologies, including material processing, test & metrology, optics alignment, and micro-assembly.
Individual applications addressed in the new brochure are:
- Assembly and Packaging of Photonic Devices
- Laser Seam Welding of Electronic Packages Using Galvo Scanners
- Laser Drilling of High-Density Micro Holes
- Wafer Stealth Dicing
- Wafer Inspection and Metrology
- Characterization of Light Emitting Devices such as Micro LEDs, SiP Wafers, etc.
- Seam Sealing of Electronic Packages Using Pulsed Laser Sources
Download “Driving Future Technologies” Brochure
Related Glossary Terms
Science of measurement; the principles on which precision machining, quality control and inspection are based. See precision machining, measurement.