CX20x3 Embedded PCs

February 11,2021

Related Glossary Terms

  • flash

    flash

    Thin web or film of metal on a casting that occurs at die partings and around air vents and movable cores. This excess metal is due to necessary working and operating clearances in a die. Flash also is the excess material squeezed out of the cavity as a compression mold closes or as pressure is applied to the cavity.

CX20x3 Incorporates AMD Processors into Embedded PC Series

The new CX20x3 Embedded PCs expand the Beckhoff Industrial PC portfolio with devices that include AMD Ryzen™ processors. This powerful hardware is ideal for 32-bit and 64-bit systems, namely TwinCAT 2 and TwinCAT 3 automation software. Users can select from Microsoft Windows 10 IoT Enterprise 2019 LTSC or the new TwinCAT/BSD operating system.

Two embedded PC variants in the CX20x3 range are currently available from Beckhoff:

  • CX2033: a fanless device without rotating parts equipped with an AMD Ryzen™ V1202B CPU (2.3 GHz clock frequency, two cores)
  • CX2043: a high-performance device with ball-bearing mounted and speed-controlled fan equipped with an AMD Ryzen™ V1807B CPU (3.35 GHz clock frequency, four cores)

The AMD processors are based on the powerful Zen architecture and offer high computing power combined with a high clock frequency. In addition, the graphics are integrated separately from the CPU cache, enabling excellent real-time characteristics.

The basic configuration of the CX20x3 includes two independent Gbit Ethernet interfaces, four USB 3.1 Gen. 2 and one DVI-D interface. In addition to the CPU and chipset, the basic module also includes 8 GB RAM. The controller boots from a removable CFast flash card. The CPU has 128 kB of internal NOVRAM as persistent data memory if a UPS is not used. A fieldbus and serial interface are available as options. All other components in the CX2000 family can be connected via the high-pole connections on both sides. The extended operating temperature range of -25...+60 °C also enables use of the system in applications with demanding climate conditions.